電子包裝雜志發(fā)表論文，使用實(shí)驗(yàn)和理論(分析和計(jì)算機(jī)輔助)的方法、方法和技術(shù)來解決和解決在電子和光子學(xué)組件、設(shè)備和系統(tǒng)的分析、設(shè)計(jì)、制造、測(cè)試和操作中遇到的各種機(jī)械、材料和可靠性問題。

The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.